Texas Instruments (TI) (NASDAQ: TXN) recently unveiled a complete 800V DC power architecture based on the NVIDIA 800 VDC reference design for next-generation AI data centers. The solution was showcased at NVIDIA's GTC Power Architecture conference and at TI's booth 169 from March 16-19, 2026, demonstrating how TI's analog and embedded processing technologies are helping NVIDIA drive its vision of revolutionizing high-voltage systems for AI data centers.
Kannan Soundarapandian, Vice President and General Manager of High Voltage Power at TI, stated, “The exponential growth of AI computing power is driving a fundamental transformation in how data centers are powered. Our advanced 800 VDC architecture is a significant breakthrough, helping data center operators address current power challenges and prepare for future AI workload demands. Through our collaboration with NVIDIA, we are accelerating the deployment of efficient and reliable AI infrastructure.”
Solving Key Power Challenges in AI Infrastructure
With the surge in AI workloads, data center power demands have reached unprecedented levels, pushing traditional power distribution architectures to their limits. TI’s 800 VDC architecture addresses these challenges by maximizing conversion efficiency and power density throughout the power path, simplifying power distribution and enabling greater scalability and reliability for AI data centers.
TI's groundbreaking solution requires only two power conversion stages to convert 800V to GPU core power: first, a compact 800V to 6V isolated bus converter with high peak efficiency, followed by a high-current-density 6V to sub-1V multiphase buck solution. This simplified architecture meets NVIDIA's reference design requirements.
Complete Power Solution
TI will showcase a comprehensive 800VDC power architecture solution at NVIDIA GTC, including several groundbreaking reference designs with industry-leading specifications:
? 800V Hot-Swappable Controller: A scalable hot-swappable solution for input power protection on the 800V power rail.
? 800V to 6V DC/DC Converter: A high-density solution integrating GaN power stages, achieving peak efficiency of up to 97.6% and a power density exceeding 2000W/in³, suitable for compute tray applications.
? 6V to Sub-1V Multiphase Buck Converter: A high-current solution for advanced GPU cores, offering power density far exceeding 12V designs, and featuring a dual-phase power stage design.
In addition, TI will showcase a 30kW, 800V high-power-density AC/DC power supply for AI servers, and an 800V capacitor bank with EDLC supercapacitor units (CBUs) achieving a power density of 40W/in³. TI will also demonstrate an 800V to 12V DC/DC bus converter for power conversion in compute trays.
Accelerating the Development of Next-Generation AI Data Centers
As AI and edge computing drive the continued growth of data centers, TI's analog and embedded processing technologies provide critical support for efficient power supply and system management. From solid-state transformers to server racks and power distribution units, and cooling distribution systems, TI's scalable semiconductor solutions are helping to build future-proof AI infrastructure.